Xerendipity Debuts at MWC Barcelona 2026

Xerendipity at MWC Barcelona 2026

As high-performance computing and advanced communication systems continue to evolve toward higher power density and tighter integration, thermal design has shifted from a material-level challenge to a system-level engineering problem.

Xerendipity will make its debut at MWC Barcelona 2026.

Hall 7 | Booth 7G87 We will present integrated thermal solutions designed to address the real-world heat dissipation demands of next-generation electronic systems.

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Two Integrated Thermal Solutions

At this year’s exhibition, Xerendipity will showcase two fully integrated thermal solutions, developed specifically for high-power systems operating under tight spatial constraints.

Vapor-Pad™

A rethinking of thermal energy transport at the SoC level, offering greater integration flexibility and new options for system-level thermal design.

NMVC

Focused on in-plane (XY) heat spreading and thermal isolation.Through a non-metallic structure, NMVC introduces an alternative system-level approach distinct from conventional metal-based solutions.

Why System-Level Thermal Design?

As power density continues to increase and system architectures become more compact, thermal challenges can no longer be solved by a single material or discrete component.

By combining modular components with system-level thermal design thinking, Xerendipity helps engineering teams balance performance, reliability, and scalability—while simplifying overall system integration.