高柏科技 T-Global

What if high-performance cooling did not have to rely on metal? From NMVC™ to Vapor-Pad™, Xerendipity is rethinking thermal management for the next generation of wireless, AI, and edge computing devices. Discover how advanced materials and system-level engineering are helping electronics stay lighter, cooler, and more reliable.

Generative AI is driving higher computing performance — and greater heat challenges. Learn how Xerendipity supports the NVIDIA computing era with Vapor-Pad™, AI liquid cooling, and advanced thermal innovation designed to improve efficiency, reliability, and stability under pressure.

Xerendipity at MWC Barcelona 2026 As high-performance computing and advanced communication systems continue to evolve toward higher power density and tighter integration, thermal design has shifted from a material-level challenge to a system-level engineering problem. Xerendipity will make its debut at MWC Barcelona 2026 . Hall 7 | Booth 7G87 We will present integrated thermal solutions designed to address the real-world heat dissipation demands of next-generation electronic systems. Two...